PURGE pH Neutral Iron and Fallout Remover - HI-Con Series

PURGE — pH-Neutral Iron & Fallout Remover (HI-CON Series)

PURGE is D-TAIL LAB’s highly efficient, pH-neutral iron remover with color-change technology that targets embedded iron and brake dust on paint, glass, plastics, and wheels—without the risks of harsh acid cleaners.

What PURGE Does

Dissolves ferrous contamination that washing can’t remove, helping prevent clear-coat deterioration and corrosion. The purple color shift shows when iron is being broken down for a thorough rinse-off.

Why You Need PURGE

• Safe & effective — pH-neutral formula with visual color-change feedback.
• Deep decontamination — clears bonded iron to restore slickness and shine.
• HI-CON performance — professional strength in an easy spray-on process.
• Versatile — use on paintwork, wheels (cool), plastics, and exterior glass.

Where to Use It

• Clear-coated paint and PPF (spot test first)
• Wheels (only when cool); calipers & brake components avoided
• Exterior glass and gloss plastics

Directions

1. For optimal results, spray on a clean, cool surface out of direct sun.
2. Allow 2–5 minutes of dwell, or until iron particles dissolve and the color change indicates activity.
3. Rinse thoroughly with water/pressure washer.
4. If needed, follow with physical decontamination using a clay towel before protection.

Compatibility & Care

• Do not use on hot panels or in direct sun; never let the product dry on the surface.
• Always test in an inconspicuous area, especially on sensitive trims and matte finishes.
• After decon, wash/rinse the panel and re-apply your preferred protection.

Pairs Well With

• Synthetic Clay Towel 3.0 — physical decon step after PURGE.
• 500 ml PET Clear Bottle with Sprayer — dedicated sprayer for wheel/paint decon.
• Edgeless 420 GSM Microfiber Towels — safe wipe-off and final buff.

Good to Know

PURGE’s color-change indicator makes it easy to see when iron is dissolving. Rinse completely, then top up protection (spray sealant or coating topper) to slow future bonding.